• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to an abrasive circulation supply device for using an abrasive in a semiconductor polishing apparatus. The present invention for implementing this is to collect the abrasive on the polishing cloth by the abrasive supply device in the polishing process of the wafer from the outer surface of the polishing cloth and supply it to the polishing process is composed of the abrasive collection device and the abrasive circulation supply device . In the polishing apparatus for attaching the polishing cloth to the rotating plate, the slurry from the polishing cloth comes out of the rotating plate by the centrifugal force of the rotating plate. The present invention is configured to install a cylindrical slurry collection device on the outer surface of the rotating plate and to use the collected slurry in the wafer polishing process by the circulation supply device.
    公开号:KR19980087667A
    申请号:KR1019980036842
    申请日:1998-09-07
    公开日:1998-12-05
    发明作者:김창규
    申请人:김창규；
    IPC主号:
    专利说明:

    Slurry circulation feeder
    The present invention relates to a slurry supply apparatus in a CMP (Chemical Mechanical Polishing) process of a semiconductor manufacturing apparatus, and collects slurry discharged during polishing, and applies the collected abrasive to the polishing process again. It is about.
    Due to the development of semiconductor manufacturing technology, high integration of semiconductor devices has been achieved. In order to achieve high integration of semiconductor devices, a planarization technique of a lower layer is required to secure a depth of focus (DOF) margin in a photolithography process or to minimize a multilayer wiring structure and wiring length. Due to this demand, a CMP process has recently been introduced as a method for planarizing the lower layer. The CMP process is a process for globally planarizing a film formed on the wafer surface, that is, a lower film, in all processes of semiconductor manufacturing. In addition, a CMP process may be applied to the conductive film to form contact plugs or wires by a damascene technique.
    The CMP process uses the chemical and physical constituents of the abrasive trapped in the abrasive cloth to polish the wafer surface. In more detail, the polishing process may be performed by chemically reacting the wafer surface with a chemical solution containing abrasive, that is, a chemical solution of abrasive, to facilitate polishing, and by the fine particles included in the abrasive. Polish the chemically reacted wafer surface. The physical force exerted on the wafer by the fine particles is defined by the pressure applied between the abrasive cloth and the wafer and the relative velocity, that is, frictional force.
    The CMP apparatus includes a polishing cloth apparatus for driving the polishing cloth to rotate, a wafer holder for supporting the wafer surface to be polished against the polishing surface of the polishing cloth device, and a slurry injection device for chemically reacting and polishing the wafer surface. The surface of the wafer is polished. In the CMP process, a certain amount of slurry must be supplied to ensure a stable process, which is closely related to the rotational speed of the polishing cloth. That is, the higher the number of revolutions, the greater the centrifugal force, so that the slurry does not participate in the polishing and many slurry comes out of the polishing cloth. Since the amount of slurry used has a great influence on the process cost, it has recently been attempted to reduce the consumption of slurry. Conventionally, a method of reducing slurry consumption includes a partition having a predetermined height, ie, a dam, at the edge of the polishing cloth to prevent the slurry from escaping by centrifugal force. Deformed, there is a problem that must be reinstalled every time the polishing cloth replacement. Another method is to recycle the slurry. Slurry regeneration apparatus has a problem in that the slurry components must be adjusted because materials such as DI water other than the slurry are mixed, the size of the apparatus is large, and the manufacturing cost is high.
    The present invention constitutes a cylindrical slurry collecting device on the outer surface of the polishing cloth to reduce the consumption of slurry, and the slurry collected in the collecting device and the slurry supplied from the main tank (mixed), the circulation supply device for supplying to the polishing cloth It is intended to have.
    It is another object of the present invention to prevent DI water or other substances other than slurry from being injected into the slurry collecting device to block the change of slurry components and to improve the reproducibility and safety of the CMP process to improve the reliability of semiconductor devices. It is in a ship.
    Another object of the present invention is to reduce the manufacturing cost by replacing a portion of the slurry supplied from the main tank (Main Slurry Tank) with the amount of slurry supplied through the circulation supply device, reducing the slurry.
    In order to achieve the above object, the present invention provides a slurry collecting device installed on the outer surface of the polishing cloth in the case of the CMP process in which the polishing cloth is rotated, so that the slurry collecting device other than the slurry (DI water for polishing cloth) It is characterized by preventing the injection. In addition, the collected slurry is supplied to the polishing cloth again by the slurry circulation device to reduce the amount of slurry supplied from the main tank (Main Tank) and at the same time characterized in that to supply a constant amount of slurry.
    1 is a front view of a slurry collecting device and a circulation supply device using two cylinders,
    2 is a front view of a drainage system using two cylinders,
    3 is a front view of a slurry collection device and a circulation supply device using two cylinders,
    4 is a plan view of a slurry collecting device using two cylinders,
    5 is a front view of the slurry collection device and the circulation supply device using one cylinder;
    6 is a front view of a slurry collection device and a circulation supply device using one cylinder;
    7 is a plan view of a slurry collecting device using one cylinder;
    8A is a front view of a slurry collecting device and a circulation supply device using an elastic tube;
    8B is a front view of the drainage device using the elastic pipe,
    8c is a plan view of a slurry collecting device using an elastic tube,
    9A is a front view of a slurry collecting device and a circulation supply device using a vacuum;
    9b is a plan view of a slurry collection device using a vacuum
    Explanation of symbols on the main parts of the drawings
    10,20,30,40,50,60,70,80,90: Carousel
    11,21,31,41,51,61,71,81,91: abrasive cloth
    12,22,32,42,82: Slurry Transfer Device
    13,23,33,43,53,63,73,83,93: slurry collection device
    14,24,34,54,64,84,94: slurry storage cylinder
    15a, 15b, 25a, 25b, 35,55,65,85,95: slurry pump
    16,26,36,56,66,86,96: Valve
    17a, 17b, 17c, 27a, 27b, 27c, 37a, 37b, 37c, 57a, 57b, 57c, 67a, 67b, 67c: slurry tube
    87a, 87b, 87c, 97a, 97b, 97c: slurry tube
    18,28,38,58,68,88,98: slurry tank
    The present invention will be described by way of example with reference to the accompanying drawings.
    1 is a front view of a slurry circulation supply apparatus according to the present invention. According to the present invention, a CMP (Chemical Mechanical Polishing) process in which an abrasive cloth is cleaned with DI water after polishing one wafer is finished, that is, a wafer is cleaned using DI water after wafer polishing and polishing. As it progresses, the invention is for resupplying the slurry from the polishing cloth to reuse it during the polishing process. In the present invention, when the slurry pump 15a is driven to supply the slurry to the rotating plate 10 to which the polishing cloth 11 is attached as shown, the slurry moves from the main slurry tank 18 in the direction A to the slurry tube. The abrasive | polishing cloth 11 is supplied over 17a, the slurry pump 15a, and the slurry pipe 17b. In the wafer polishing process, the slurry supplied to the polishing cloth exits outside, i.e., B and B 'directions by the centrifugal force of the rotating plate. The slurry exiting in the B and B 'directions flows to the slurry collecting device 13 through the slurry moving device 12 installed in a cylindrical shape on the outer wall of the polishing cloth. In the present invention, the slurry moving device 12 and the slurry collecting device 13 are configured in a cylindrical shape on the outer shell of the rotating plate. The slurry transfer device 12 aims to send the slurry to the collecting device 13 and to prevent substances other than the slurry such as DI Water from flowing into the collecting device 13. The slurry transfer device 12 is configured to move up and down by electric signals or air pressure. When the highest portion of the slurry transfer device 12 is equal to or lower than the polishing cloth 11, the slurry supplied to the polishing cloth 11 moves in the B and B 'directions by the rotational force of the polishing cloth. As a result it is collected in the collecting device (13). The slurry collected in the collection device is stored in a storage cylinder 14 of several hundred ml (ml) size. When a predetermined amount or more of the slurry is stored in the storage cylinder 14, the slurry pump 15b is driven and the slurry is supplied to the slurry tube 17c, that is, the C direction through the 3-way valve 16. In the present invention, when the slurry pump 15a is driven to supply a predetermined amount of slurry to the polishing cloth, all the slurry supplied to the polishing cloth is supplied from the main tank 18 unless the slurry pump 15b is driven, and the slurry pump When the slurry is supplied from 15b, the amount of slurry supplied from the main tank 18 is reduced by the amount of slurry supplied from the slurry pump 15b. In the present invention, the 3-way valve 16 implements drainage in the D direction (17d) when the slurry circulation supply and the CMP process are finished or other purposes for cleaning the slurry collection pipe with DI water. Device. In the present invention, the slurry moving device 12 and the slurry collecting device 13 may be installed independently on the outer shell of the rotating plate, and may be attached to the rotating plate. Alternatively, the slurry transfer device, i.e., the inner cylinder, is attached to the rotating plate and rotates simultaneously with the rotating plate to move up and down independently, that is, when the slurry is supplied to the polishing cloth, and move below the polishing cloth. When supplied to the polishing cloth is configured to be moved above the polishing cloth, the slurry collection device 13 is preferably fixed to the outside.
    FIG. 2 is a front view of the drainage device in the slurry circulation supply device as shown in FIG. 1. FIG. 2 shows that DI water moves along the B and B 'directions by raising the slurry transfer device 12 higher than the polishing cloth so that DI water does not enter the slurry collecting device 23 when cleaning the polishing cloth with DI water. It was configured to drain.
    3 is a front view of another slurry circulation supply apparatus according to the present invention. In the present invention, the slurry collected in the storage cylinder is circulated and supplied using only the main slurry pump 35. In more detail, when the slurry pump 35 is driven to supply the slurry to the rotating plate 30 to which the polishing cloth 31 is attached, the slurry moves from the main slurry tank 38 in the direction A to the slurry. The polishing cloth 31 is supplied over the pipe 37a, the slurry pump 35, and the slurry pipe 37b. In the wafer polishing process, the slurry supplied to the polishing cloth exits outside, i.e., B and B 'directions by the centrifugal force of the rotating plate. The slurry exiting in the B and B 'directions flows to the slurry collecting device 33 through the slurry moving device 32 provided on the outer wall of the polishing cloth. The slurry collected in the collecting device is stored in the storage cylinder 34. When a predetermined amount or more of the slurry is stored in the storage cylinder 34, the on / off valve 36 is opened and the slurry is supplied through the slurry tube 37c, that is, in the C direction. In the present invention, when the slurry pump 35 is driven to supply a certain amount of slurry to the polishing cloth, all of the slurry supplied to the polishing cloth is supplied from the main tank 38 unless the on / off valve 36 is driven. When the on / off valve 36 is driven to open the valve, the amount of slurry supplied from the main tank 18 decreases as much as the amount of slurry supplied from the valve. In the present invention, the On / Off valve 36 is configured to supply a certain amount of slurry by preventing air from being injected when there is no slurry in the slurry storage cylinder.
    4 is a plan view of the slurry transfer device and the collection device of FIGS. 1, 2, and 3. The slurry transfer device 42 and the slurry collection device 43 are configured outside the polishing cloth 41. The moving device 42 is attached to the rotating plate or driven away from the outside.
    5 is a front view of another slurry circulation supply device. In the present invention, when the DI water is not used for the cleaning of the polishing cloth after wafer polishing, that is, when only the slurry is used until the process is completed, the slurry collecting device 53 is installed on the outer surface of the polishing cloth 51, and the slurry It is a front view of the slurry circulation supply apparatus configured to resupply the slurry which escaped to the polishing cloth by using the storage cylinder, the on / off valve and the main slurry pump 55. In the present invention, since there is no DI water cleaning between the polishing wafers, the object of the present invention can be achieved only by the slurry collecting device 53 without the slurry moving device.
    6 is a front view of another slurry circulation supply device in which only the slurry is collected by moving the slurry collecting device 63 up and down without separately making the slurry moving device and the slurry collecting device. In more detail, when the slurry is supplied to the polishing cloth, the collecting device 63 is lowered so that the height of the inlet of the collecting device 63 is equal to or lower than the polishing cloth so that the slurry moves to B and B '. As a result, the slurry enters the slurry collection pipe 63, moves through the slurry storage cylinder 64 and the on / off valve 64 in the C direction, and is re-supplied to the polishing cloth.
    7 is a plan view of the collecting device of FIGS. 5 and 6. It is a circulation supply apparatus which comprised the cylindrical slurry collection apparatus in the outer shell of the polishing cloth 71. As shown in FIG.
    8A is a front view of another slurry collection device and a circulation supply device of the present invention. The present invention consists of an elastic tube 82a having at least one elasticity in a slurry moving device 82 having a cylindrical groove around a rotating plate. Another cylindrical slurry collection pipe 83 in which the inlet is directed to the rotating plate outside the rotating plate is installed, and configured to move up and down. When the slurry pump 85 is driven to supply the slurry to the polishing cloth, the slurry is supplied from the main tank to the polishing cloth along the slurry pipe 87a and the slurry pipe 87b. The slurry supplied to the polishing cloth is moved by the rotational force of the polishing cloth along the elastic tube 82a of the slurry transfer device 82 to the internal collecting device 82 provided on the outer plate of the rotating plate. The elastic tube is then located at the inlet of the external collection device to collect the slurry. The slurry collected in the outer collecting tube is moved to the slurry storage cylinder 84, and when the storage cylinder is filled with a predetermined amount of slurry, the on / off valve is opened, and the slurry moves along the slurry tube 87c in the C direction to refill the abrasive cloth. Will be supplied. Therefore, the amount of slurry supplied from the main tank 88 can be reduced by the amount of slurry moved in the C direction.
    8B is a front view of the drainage device using the elastic pipe. In the present invention, when the wafer polishing process is completed and the polishing cloth is carried with DI water, the external slurry collecting device 83 is moved upward to configure the elastic tube 83 to go below the inlet of the external slurry collecting device. Therefore, DI Water can enter the slurry collection device and prevent the slurry component from changing.
    FIG. 8C is a plan view of the slurry circulation supply device in FIGS. 8A and 8B. In the present invention, the slurry collecting device is composed of a slurry moving device 82, an elastic tube 82a, and a slurry collecting device 83 attached to the circumference of the rotating plate to which the polishing cloth 81 is attached.
    9A is a front view of yet another circulation supply device using an air pressure converter. In the present invention, the pressure conversion device 99 was used as a method of collecting the slurry. When the slurry is supplied to the polishing cloth, the air pressure converting device 99 lowers the air pressure and sucks the slurry coming out of the polishing cloth to a cylindrical suction device installed on the outer wall of the rotating plate through the fine suction pipe 93a, thereby storing the storage cylinder 94. To pass. When a predetermined amount or more of the slurry is stored in the storage cylinder, the on / off valve 96 is operated to supply the slurry in the C direction, and the slurry supplied from the circulator is passed through the slurry pump 95. Therefore, the amount supplied from the slurry main tank 88 can be reduced by the amount of slurry supplied from the circulation device. In the present invention, when DI water is supplied for the purpose of carrying the polishing cloth, air is blown from the air pressure conversion device 99 to prevent DI water from entering the collection pipe. Atmospheric pressure converting device can use vacuum, pressurized air, and N2 supplied from semiconductor manufacturing line.
    It is a top view of the circulation supply apparatus using an air pressure conversion apparatus. In the present invention, a cylindrical slurry collection tube 93 is installed on the outer surface of the polishing cloth 91, and the collection tube 93 includes a plurality of suction nozzles 93a. The slurry may be collected through the suction pipe 93a.
    The slurry collection device may be implemented by another method in addition to the above invention. For example, a groove or slit may be formed at the edge of the polishing cloth, and an opening / closing device may be installed so that only the slurry enters the groove or slit. The collected slurry is circulated to the polishing cloth through the storage cylinder, the on / off valve and the main slurry pump, or circulated to the polishing cloth through the storage cylinder, the 3-way valve, the circulation slurry pump and the main slurry pump.
    As described above, in the present invention, the slurry supplied from the main tank comes out by the centrifugal force of the polishing cloth. The slurry coming out of the polishing cloth is collected in a collecting device, and the slurry is supplied from the main tank by circulating and supplying the slurry to the wafer polishing process. It can reduce the amount of slurry and reduce the manufacturing cost. Therefore, the effect of improving the productivity of the semiconductor device is provided. In addition, the present invention provides an effect that can be applied to other chemical apparatuses as well as the slurry.
    权利要求:
    Claims (5)
    [1" claim-type="Currently amended] In the apparatus for polishing a wafer,
    A collecting device for collecting the slurry escaped to the edge by the polishing cloth rotational force outside the polishing cloth during wafer polishing;
    Slurry circulation supply apparatus characterized in that for supplying the collected slurry and the slurry of the main tank at the same time to the wafer polishing process.
    [2" claim-type="Currently amended] The method of claim 1,
    The slurry collecting device is a slurry collecting device, characterized in that for collecting the slurry separately using a slurry transfer device.
    [3" claim-type="Currently amended] The method of claim 1,
    The slurry collecting device and the slurry moving device are installed on the rotating plate, or independently installed around the rotating plate, or the slurry moving device is installed on the rotating plate and the slurry collecting device is installed independently of the rotating plate.
    [4" claim-type="Currently amended] The method of claim 1,
    The slurry collecting device is a slurry collecting device, characterized in that using a slurry moving device or suction device or elastic tube.
    [5" claim-type="Currently amended] The method of claim 1,
    The apparatus for circulating and supplying the slurry may simultaneously supply the collected slurry and the slurry of the main tank to the collecting device by using a storage cylinder, a valve, and a main slurry pump or a storage cylinder, a valve, a circulation slurry pump, and a main slurry pump. Circulating feeder.
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    同族专利:
    公开号 | 公开日
    KR100308641B1|2001-11-30|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1998-09-07|Application filed by 김창규
    1998-09-07|Priority to KR1019980036842A
    1998-12-05|Publication of KR19980087667A
    2001-11-30|Application granted
    2001-11-30|Publication of KR100308641B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019980036842A|KR100308641B1|1998-09-07|1998-09-07|Apparatus for supplying circularly slurry|
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